Semiconductor Materials and Solutions

High-purity materials from the start

Contamination control begins before the wafer enters device fabrication. MCG supplies high-purity materials and processing technologies for silicon and compound-semiconductor wafer production.

Our capabilities include:

• Ultra-high-purity synthetic silica for quartz crucibles and components
• High-purity process chemicals and cleaning formulations
• Bulk GaN substrates for power, RF, optical, and electronic applications
• Wafer processing and reclaim services

Mitsubishi Synthetic Silica offers documented SiO₂ purity above 99.99999%, with individual measured metal impurities generally below 10–20 ppb.

• Deposition materials for controlled thin-film formation – Chemical vapor deposition (CLD) and atomic layer deposition (ALD) require precursors with suitable purity, volatility, thermal stability, and surface reactivity.
  MCG and Gelest provide high-purity organometallic and organosilicon synthesis and precursor-development capabilities for CVD and ALD processes.
• Materials for advanced lithography – Advanced patterning requires precise control over resist chemistry, precursor purity, molecular behavior, and film formation. High-NA EUV introduces further challenges involving absorption, dose, defectivity, and process control.
  Our technologies include: Lithomax™ high-purity resist polymers for ArF and EUV lithography, aquaSAVE™ antistatic material for advanced photomask manufacturing, and Tin-based metal-organic precursors under development for CVD-deposited dry resist.
• Cleaning and contamination control – Particles, metals and organic residues can interfere with contamination-sensitive wafer processes. MCG offers ultra-high-purity chemicals and formulated cleaning materials designed for specific process conditions.
  MCG cleaning chemistry combines NH₄OH with chelating-agent technology to remove particles and organic residues while capturing metals and helping to prevent their rebinding to the wafer surface.

Materials for interconnect formation – Continued interconnect scaling creates demanding requirements for deposition, planarization, and post-CMP cleaning. MCG capabilities include:

• CVD and ALD precursors
• High-purity wet chemistry
• Post-CMP cleaning materials
• Engineered plastics for CMP equipment

Techtron™ engineering plastic is used in CMP retaining-ring applications requiring mechanical and dimensional performance during repeated chemical and mechanical exposure.

Balancing thermal expansion, flow and processability

Chiplets, hybrid bonding, wafer-level packaging, panel-level packaging, and 3D integration bring multiple materials together within increasingly dense structures. This makes thermal expansion, viscosity, adhesion, insulation, and heat transfer critical considerations.

MCG technologies include:

• Spherical negative-thermal-expansion fillers for underfill and molding compounds
• jER™ epoxy resins for insulation, adhesion, and encapsulation
• Ultra-thin thermally conductive films under development
• DIAFOIL™ functional films for dicing and packaging
• Non-fluorinated polyester mold-release films under development for wafer- and panel-level packaging

In experimental evaluation and capillary-flow simulation, MCG’s surface-treated NTE filler demonstrated lower CTE with practical viscosity and filling of a 50 μm gap.

• Selective wet etching for Si and SiGe structures – Backside power delivery network integration requires silicon removal while preserving increasingly thin SiGe etch-stop layers.
  MCG has developed an engineered alkaline Si/SiGe wet etchant that achieved approximately 750 selectivity in full 12-inch single-wafer processing, compared with approximately 160 for conventional chemistry.
• Power semiconductor materials – Power devices require careful management of substrate quality, heat, electrical insulation, and high-temperature operating conditions.
  MCG provides:
  • Bulk GaN substrates produced using HVPE and ammonothermal technologies
  • Electrically insulating thermal materials
  • Thermally conductive films
  • Materials for power-electronics components and assemblies

Equipment components must perform under aggressive chemical exposure, mechanical wear, and strict contamination controls.

MCG supplies engineered plastics, carbon-fiber composites and functional polymers for wafer handling, CMP equipment, semiconductor transport, and structural components.

DIALEAD™ pitch-based carbon-fiber end effectors combine high stiffness and low weight with vibration damping, Electrostatic Dissipation (ESD) control, chemical resistance, and near-zero axial Coefficient of Thermal Expansion (CTE).

MCG Group capabilities also support semiconductor manufacturing infrastructure through:

• Wafer reclaiming and processing
• Precision equipment cleaning
• Ultrapure-water production
• Wastewater treatment and recycling
• Chemical supply and recovery systems